- Home
- Passive Components
- Ceramic Chip High Values
- SAMSUNG Electro-Mechanics Ceramic Chip High Values
KC 10µF 1206 10% 16V X7R
Supplier:
SAMSUNG Electro-Mechanics
Matchcode:
KC10U1206X7R016K NORM
Rutronik No.:
KKS4080
Unit Pack: 8000
MOQ: 8000
package: 1206
Packaging: REEL BLI
- C(N)
-
10µ F
- Case size
-
1206
- Dielectric
-
X7R
- V(N)
-
16 V
- Tolerance
-
10%
- Product status
-
PRODUCTION
- Design / type
-
STANDARD
- Purpose of use
-
COMMERCIAL
- T(A) min
-
-55 °C
- T(A) max
-
+125 °C
- Bendingstrength
-
1 mm
- Termination
-
NISN
- Length
-
3.2 mm
- Diameter/width
-
1.6 mm
- Height
-
1.6 mm
- Tape type
-
13 inch
- Tape width
-
8 mm
- Tape pitch
-
4 mm
- Packaging
-
REEL BLI
- Automotive
-
NO
- RoHS Status
-
RoHS-conform
- Package
-
1206
- Style
-
CHIP
- ECCN
- EAR99
- Customs Tariff No.
- 85322400000
- Country
- Philippines
- ABC-Code
- C
- Supplier Lead time
- 24 weeks
With the articles in your cart you can send us an order, or - if you have further questions - a non-binding request.
KC 10µF 1206 10% 16V X7R
package:
1206
Packaging:
REEL BLI
KC 10µF 1206 10% 16V X7R
package:
1206
Packaging:
REEL BLI
Topseller
KC 10µF 1206 10% 16V X7R
package:
1206
Packaging:
REEL BLI
Topseller
KC 10µF 1206 10% 16V X7R
package:
1206
Packaging:
REEL BLI
KC 10µF 1206 10% 25V X7R
package:
1206
Packaging:
REEL BLI
KC 10µF 1206 10% 16V X7R
package:
1206
Packaging:
REEL BLI
KC 10µF 1206 10% 25V X7R
package:
1206
Packaging:
REEL BLI
KC 10µF 1206 10% 25V X7R
package:
1206
Packaging:
REEL BLI
Topseller
KC 10µF 1206 10% 50V X7R
package:
1206
Packaging:
REEL BLI
KC 10µF 1206 10% 10V X7R
package:
1206
Packaging:
REEL BLI
Previous
Next