TH58BYG3S0HBAI6_TRAY
TH58BYG3S0HBAI6_TRAY
Description:
8Gb BeNAND 24nm BGA Tray 1.8 P2 Ind
Supplier:
KIOXIA Europe GmbH
Unit Pack:
338
MOQ:
338
package:
BGA67
Packaging:
TRAY