TH58BVG2S3HBAI4_TRAY
TH58BVG2S3HBAI4_TRAY
Description:
4Gb BeNAND 24nm BGA Tray 3 Ind PL2
Supplier:
KIOXIA Europe GmbH
Unit Pack:
210
MOQ:
210
package:
BGA63
Packaging:
TRAY