- Home
- Passive Components
- Ceramic Chip Automotive
- KEMET a YAGEO company Ceramic Chip Automotive
KC 33nF 1210 5% 630V NP0 AECQ
Supplier:
KEMET a YAGEO company
Matchcode:
KC33N1210NP0630JAECQ
Rutronik No.:
KKA1857
Unit Pack: 1000
MOQ: 1000
package: 1210
Packaging: REEL BLI
- C(N)
-
33n F
- Case size
-
1210
- Dielectric
-
NP0
- V(N)
-
630 V
- Tolerance
-
5%
- Product status
-
NO INFO
- Design / type
-
STANDARD
- Purpose of use
-
AUTOMOTIVE
- T(A) min
-
-55 °C
- T(A) max
-
+125 °C
- Bendingstrength
-
2 mm
- Termination
-
NISN
- Length
-
3.2 mm
- Diameter/width
-
2.5 mm
- Height
-
2.5 mm
- Tape type
-
7 inch
- Tape width
-
8 mm
- Tape pitch
-
4 mm
- Packaging
-
REEL BLI
- Automotive
-
AEC-Q(200)
- RoHS Status
-
RoHS-conform
- Package
-
1210
- Style
-
CHIP
- ECCN
- EAR99
- Customs Tariff No.
- 85322400000
- Country
- Mexico
- Supplier Lead time
- 21 weeks
With the articles in your cart you can send us an order, or - if you have further questions - a non-binding request.
KC 33nF 2220 10% 1000V NP0...
package:
2220
Packaging:
REEL BLI
KC 33nF 1812 5% 630V NP0 AECQ
package:
1812
Packaging:
REEL BLI
KC 33nF 3640 5% 1200V NP0 AECQ
package:
3640
Packaging:
REEL BLI
KC 33nF 0603 10% 50V X7R AECQ
package:
0603
Packaging:
REEL PAP
KC 33nF 0603 5% 25V X7R AECQ
package:
0603
Packaging:
REEL PAP
KC 33nF 0805 5% 50V X7R AECQ
package:
0805
Packaging:
REEL PAP
KC 33nF 1206 10% 250V X7R AECQ
package:
1206
Packaging:
REEL BLI
KC 33nF 1206 10% 50V X7R AECQ
package:
1206
Packaging:
REEL PAP
KC 33nF 0805 10% 100V X7R AECQ
package:
0805
Packaging:
REEL BLI
KC 33nF 0603 10% 50V X7R AECQ
package:
0603
Packaging:
REEL PAP
Previous
Next