Cart

AF010GEC5A-2004IX

ATP AF010GEC5A-2004IX

image shown is a representation only

ATP

pSLC eMMC 10GByte 5.1 I-Temp
Supplier: ATP
Matchcode: EMMC10
Rutronik No.: ICEMMC1176
Unit Pack: 1000
MOQ: 1000
package: BGA153
Packaging: REEL
Find Alternatives
Find Alternatives
Datasheet
Datasheet

Download the free Library Loader to convert this file for your ECAD Tool
Please login
18.15 $
18,150.00 $

pSLC eMMC 10GByte 5.1 I-Temp Description

The ATP industrial e.MMC is an advanced storage solution that integrates NAND flash memory, a sophisticated flash controller, and a fast MultiMedia Card (MMC) interface in the same package. By incorporating these components in an integrated package, ATP e.MMC manages all background operations internally, freeing the host from handling low-level flash operations for faster and more efficient processing.

Smaller than a typical postage stamp, ATP e.MMC comes in a 153-ball fine pitch ball grid array (FBGA package). The tiny footprint makes it perfectly suitable for embedded systems with space constraints but require rugged endurance, reliability and durability in harsh environments.

ATP e.MMC is built to meet the tough demands of industrial applications. As a soldered-down solution, it is secure against constant vibrations. Its industrial temperature rating means that severe scenarios from freezing cold -40°C to blistering hot 105°C will not cause adverse impact on the device or the data in it.

Compliant with the latest JEDEC e.MMC 5.1 Standard (JESD84-B51), ATP e.MMC features Command Queuing and Cache Barrier to enhance random read/write performance; High Speed 400 (HS400) DDR Mode for a bandwidth of up to 400 MB/s; and field firmware update (FFU). Enhanced Strobe in HS400 Mode facilitates faster synchronization between the host and the e.MMC device; and, Secure Write Protection ensures that only trusted entities can protect or unprotect the e.MMC device.

It is backward compatible with previous versions (v4.41/v4.5/v5.0), supporting features such as power-off notifications, packed commands, cache, boot or replay protected memory block (RPMB) partitions, high priority interrupt (HPI), and hardware (HW) reset.

Features:

  • AEC-Q100 Grade 2 (-40°C~105°C) compliant*
  • AEC-Q100 Grade 3 (-40°C~85°C) compliant*
  • Extra-high endurance: 2-3X higher than standard e.MMC*
  • Complies with JEDEC e.MMC v5.1 Standard (JESD84-B51)
  • 153-ball FBGA (RoHS compliant, "green package")
  • LDPC ECC engine*

* May vary by product and project support

Parameter

Type
pSLC
Density
10G Byte
Oper.temp.min.
-40 °C
Oper.temp.max.
85 °C
Package
BGA153
Package width
11.5x13 mm
U(ccq)
1,70/1,95 V
U(cc)
2,7/3,6 V
Automotive
NO
Packaging
REEL
RoHS Status
RoHS-conform
ECCN
EAR99
Customs Tariff No.
85423219000
Country
Taiwan
Supplier Lead time
101 weeks
With the articles in your cart you can send us an order, or - if you have further questions - a non-binding request.

Password forgotten?