- Home
- Ceramic Chip High Values
- Samsung Electro-Mechanics Ceramic Chip High Values

KC 1,0µF 1206 -20+80% 50V Y5V
Supplier:
Samsung Electro-Mechanics
Matchcode:
KC1,0U1206Y5V050Z NORM
Rutronik No.:
KKK14999
Unit Pack: 2000
MOQ: 2000
package: 1206
Packaging: REEL BLI
- C(N)
-
1µ F
- Case size
-
1206
- Dielectric
-
Y5V
- V(N)
-
50 V
- Tolerance
-
-20+80%
- Productstatus
-
NRND
- Design / type
-
STANDARD
- Purpose of use
-
COMMERCIAL
- T(A) min
-
-30 °C
- T(A) max
-
+85 °C
- Bendingstrength
-
1 mm
- Termination
-
NISN
- Length
-
3.2 mm
- Diameter/width
-
1.6 mm
- Height
-
1.25 mm
- Tape type
-
7 inch
- Tape width
-
8 mm
- Tape pitch
-
4 mm
- Packaging
-
REEL BLI
- Automotive
-
NO
- Leadfree Defin.
-
10
- Package
-
1206
- Style
-
CHIP
- ECCN
- EAR99
- Customs Tariff No.
- 85322400000
- Country
- Philippines
- ABC-Code
- C
- Supplier Lead time
- 28 weeks
With the articles in your cart you can send us an order, or - if you have further questions - a non-binding request.
KC 1,0µF 1206 -20+80% 50V Y5V
package:
1206
Packaging:
REEL BLI
KC 1,0µF 1206 -20+80% 50V Y5V
package:
1206
Packaging:
REEL PAP
KC 1,0µF 1206 20% 50V Y5V
package:
1206
Packaging:
REEL PAP
KC 1,0µF 1206 10% 50V X7R
package:
1206
Packaging:
REEL BLI
KC 1,0µF 1206 10% 25V X7R
package:
1206
Packaging:
REEL BLI
KC 1,0µF 1206 10% 50V X7R
package:
1206
Packaging:
REEL BLI
KC 1,0µF 1206 10% 50V X7R
package:
1206
Packaging:
REEL BLI
KC 1,0µF 1206 5% 50V X7R
package:
1206
Packaging:
REEL BLI
KC 1,0µF 1206 10% 100V X7R
package:
1206
Packaging:
REEL BLI
KC 1,0µF 1206 10% 16V X7R
package:
1206
Packaging:
REEL BLI
Previous
Next