- Home
- Ceramic Chip High Values
- Samsung Electro-Mechanics Ceramic Chip High Values
KC 1,0µF 0402 10% 6,3V X6S
Supplier:
Samsung Electro-Mechanics
Matchcode:
KC1,0U0402X6S6,3K NORM
Rutronik No.:
KKK24955
Unit Pack: 10000
MOQ: 240000
package: 0402
Packaging: REEL PAP
- C(N)
-
1µ F
- Case size
-
0402
- Dielectric
-
X6S
- V(N)
-
6.3 V
- Tolerance
-
10%
- Productstatus
-
PRODUCTION
- Design / type
-
STANDARD
- Purpose of use
-
COMMERCIAL
- T(A) min
-
-55 °C
- T(A) max
-
+105 °C
- Bendingstrength
-
1 mm
- Termination
-
NISN
- Length
-
1 mm
- Diameter/width
-
0.5 mm
- Height
-
0.5 mm
- Tape type
-
7 inch
- Tape width
-
8 mm
- Tape pitch
-
2 mm
- Packaging
-
REEL PAP
- Automotive
-
NO
- Leadfree Defin.
-
10
- Package
-
0402
- Style
-
CHIP
- ECCN
- EAR99
- Customs Tariff No.
- 85322400000
- Country
- China
- ABC-Code
- C
- Supplier Lead time
- 28 weeks
With the articles in your cart you can send us an order, or - if you have further questions - a non-binding request.
KC 1,0µF 0402 10% 10V X6S
package:
0402
Packaging:
REEL PAP
KC 1,0µF 0402 10% 6,3V X5R
package:
0402
Packaging:
REEL PAP
KC 1,0µF 0402 10% 6,3V X5R
package:
0402
Packaging:
REEL PAP
KC 1,0µF 0402 10% 6,3V X7R
package:
0402
Packaging:
REEL PAP
KC 1,0µF 0402 10% 6,3V X7R
package:
0402
Packaging:
REEL PAP
KC 1,0µF 0402 10% 6,3V X7R
package:
0402
Packaging:
REEL PAP
KC 1,0µF 0402 10% 6,3V X5R
package:
0402
Packaging:
REEL PAP
KC 1,0µF 0402 10% 25V X5R
package:
0402
Packaging:
REEL PAP
KC 1,0µF 0402 10% 16V X5R
package:
0402
Packaging:
REEL PAP
Topseller
KC 1,0µF 0402 10% 25V X5R
package:
0402
Packaging:
REEL PAP
Previous
Next
