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MB85RS1MTPW-G-APE1

FUJITSU MB85RS1MTPW-G-APE1

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FUJITSU

FRAM SPI 128Kx8 WLP8 3.0V
Supplier: Fujitsu
Matchcode: MB85RS1MTPW-G-APE1
Rutronik No.: ICPROM9963
Unit Pack: 300
MOQ: 300
package: WLP8
Packaging: TRAY
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4.36 $
1,308.00 $

Prices

300 4.36 $
600 4.24 $

FRAM SPI 128Kx8 WLP8 3.0V Description

The 8 pin wafer level chip scale package (WL-CSP) is an additional package variant to the existing product MB85RS1MT. In comparison to the industry standard SOP-8 package, the new WL-CSP package, which measures 3.09x2.28x0.33mm, reduces the surface mounting area by 77%, and the device height by 80%. With this product release, Fujitsu is offering 1Mbit SPI FRAM product with the industry’s smallest packaging technology.

The WL-CSP package makes FRAM the ideal non-volatile memory solution for wearable and sensor applications. These fast expanding markets request ultra small device dimensions, extremely low power consumption for maximum battery lifetime, and high endurance in write cycles in case of real time logging. Exactly in these aspects, FRAM is delivering an excellent performance.

Parameter

Type
SPI
Density
1M bit
Organisation
128Kx8
Package
WLP8
Read/write cycl
10B
Permis.T(A) min
-40 °C
Permis.T(A) max
85 °C
U(cc)min
2.7 V
U(cc)max
3.6 V
Automotive
NO
Leadfree Defin.
RoHS-conform
Packaging
TRAY
ECCN
EAR99
Customs Tariff No.
85423290000
Country
United States
ABC-Code
A
Supplier Leadtime
16 weeks
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