Cart

RS13100-EVK1

REDPINE RS13100-EVK1

image shown is a representation only

REDPINE

RS13100 WiSeMCU EVAL.KIT
Supplier: Redpine Signals
Matchcode: RS13100-EVK1
Rutronik No.: RFMCU1394
Unit Pack: 1
MOQ: 1
package: INDIVIDUAL
Packaging: INDIVIDUAL
In Stock
141.56 $
141.56 $

RS13100 WiSeMCU EVAL.KIT Description


RS13100 Wireless MCU SoCs & Modules

Redpine Signals' RS13100 WiSeMCU family of SoCs and modules provides ultra-low power dual-mode Bluetooth®5, 802.15.4 and up to 180 MHz ARM®Cortex®-M4F application processor with advanced security and a rich set of digital/analog peripherals. The RS13100 provides the necessary wireless connectivity options and processing power for audio, data transfer, locationing and control/monitoring applications for wearable, home automation, industrial automation, lighting and home appliance markets.


Solution Highlights


  • Highly integrated and secure solution with dual-mode Bluetooth 5 and 802.15.4 (capable of running ZigBee or Thread)
  • Efficient on-chip application processor based on ARM® Cortex®-M4F with up to 180 MHz performance, up to 4 MB dedicated flash and up to 208 kB of RAM
  • Support for BLE 5 long range (125 kbps), high data rate (2 Mbps) and advertising extensions
  • Ultra-low power consumption with multiple power modes to reduce the system energy consumption
  • Multiple levels of security including PUF (Physically Unclonable Function), Crypto HW accelerators, Secure Bootloader and Secure Zone, to create a highly secure system
  • Ultra-small size SoC (3.51 mm x 3.6 mm) and module (4.63 mm x 7.90 mm) options (additional package options are also available)
  • Integrated wireless stacks and profiles for easy evaluation and integration
  • Leading edge RF performance (up to 20 dBm output power for BLE and 802.15.4) providing long range up and higher throughputs
  • Unique peripherals like ULP sub-system, Voice Activity Detection (VAD) and up to 8 capacitive touch sensor inputs


Block diagram

          


Microcontroller
  • ARM® Cortex®-M4 core with up to 180 MHz
  • Integrated FPU, MPU and NVIC
  • SWD and JTAG debug options
  • Internal and external oscillators with PLLs
  • Flash In-Application Programming (IAP), In-System Programming (ISP) and Over-the-Air Wireless Firmware Upgrade
  • Power-On Reset (POR), Brown-Out and Black-out Detect (BOD) with separate thresholds
Memory
  • Up to 4 MB integrated Quad-SPI flash with inline AES engine and XIP
  • Up to 208 KB SRAM
  • 4-way set-associative 16 KB I-Cache
Security
  • HW device identity and key storage with PUF
  • Trusted Execution Environment with Secure Boot loader
  • Accelerators: AES128/256, SHA256/384/512, RSA, ECC, ECDH, RNG, CRC
Bluetooth
  • Compliant to dual-mode Bluetooth 5
  • Transmit power up to +20 dBm1 for Bluetooth LE with integrated PA
  • Transmit power up to +15 dBm1 for Bluetooth EDR with integrated PA
  • Receive sensitivity as low as -104 dBm1
  • Data rates: 125 kbps, 500 kbps, 1 Mbps, 2Mbps, 3 Mbps
  • EDR+2.1, 4.0, 4.1, 4.2 and 5.0
  • BT LE 1 Mbps, 2 Mbps and Long Range modes
  • Piconet and scatternet
  • BT profile support2 for SPP, A2DP, AVRCP, HFP, PBAP, IAP, GAP, SDP, L2CAP, RFCOMM, GATT, IAP1, IAP2
  • BLE profile support2: GATT, PXP, HTP, HRP, BPM, VSPP, IPSP/IPSS, BLP, CGMP/CGMS, HOGP HID
802.15.42
  • Compliant to IEEE 802.15.4, 2.4 GHz
  • Transmit power up to +20 dBm1 with integrated PA
  • Receiver sensitivity of -102 dBm1
  • ZigBee PRO and Thread stack embedded
  • Supported modes2: ZigBee Coordinator, Router1, End device
  • Supported profiles2: Zigbee Light Link (ZLL), Home Automation (HA) and Smart Energy (SEP)
  • Supported Thread modes2: Border Router, Router, End Device
RF Features
  • Integrated baseband processor with calibration memory, RF transceiver, high-power amplifier, balun, T/R switch and flash memory (module)
MCU Sub-system Power Consumption
  • Active current as low as 19uA/MHz1 in low power mode
  • Deep sleep mode current: ~500nA1
  • Dynamic Voltage & Frequency Scaling
  • Deep sleep mode with only timer active - with and without RAM retention
Wireless Sub-system Power Consumption
  • 7.7 mA1 transmit current in BT 5 mode, 0 dBm output power, 1 Mbps data rate
  • 15 uA1 in BT 5 Connected mode (1s connection interval, 0dBm, 0byte)
  • 10.2 mA1 receive current in BT 5 mode, 1Mbps data rate
Digital Peripherals
  • USB HS OTG with integrated HS transceiver
  • 10/100 Mbps Ethernet MAC with RMII
  • SDIO 3.0 host and slave, SD/eMMC
  • 3x USART, 4x SPI, 3x I2C, 2x I2S, SIO, CAN 2.0B
  • Timers: 5x 32-bit, 1x 16/32-bit, 1x 24-bit, WWDT, RTC, RIT, QEI
  • Up to 85 GPIOs with GPIO multiplexer
Analog Peripherals
  • 12-bit 16-ch, 5 Msps ADC, 10-bit DAC
  • 3x op-amps, 2x Comparators and Temperature Sensor
  • 8 capacitive touch sensor inputs
  • Voice Activity Detection (VAD)
Software and Regulatory Certification
  • ZigBee Certification2, Bluetooth Qualification2
  • Regulatory certifications (FCC, IC, CE, ETSI, TELEC)2
Operating Conditions
  • Single supply: 2.1 to 3.6V or 1.85V
  • Operating temperature: -40°C to +85°C (Industrial grade)
Packages
  • LGA module
  • SoC packages - WLCSP, QFN and BGA
Evaluation Kit
  • RS13100-EVK1



Parameter

Frequency min
2400 MHz
Frequency max
2400 MHz
Automotive
NO
Package
INDIVIDUAL
Leadfree Defin.
10
Packaging
INDIVIDUAL
Customs Tariff No.
85437090990
Country
China
Supplier Lead time
22 weeks
With the articles in your cart you can send us an order, or - if you have further questions - a non-binding request.

Password forgotten?