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RS13100-0B00-210F-B00

REDPINE RS13100-0B00-210F-B00

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REDPINE

BT5+THREAD+180MHz+C.1MB FLASH
Supplier: Redpine Signals
Matchcode: RS13100-0B00-210F-B00
Rutronik No.: RFMCU1433
Unit Pack: 364
MOQ: 364
package: MODULE
Packaging: TRAY
On request
15.50 $
5,642.00 $

BT5+THREAD+180MHz+C.1MB FLASH Description


RS13100 Wireless MCU SoCs & Modules



Redpine Signals' RS13100 WiSeMCU family of SoCs and modules provides ultra-low power dual-mode Bluetooth®5, 802.15.4 and up to 180 MHz ARM®Cortex®-M4F application processor with advanced security and a rich set of digital/analog peripherals. The RS13100 provides the necessary wireless connectivity options and processing power for audio, data transfer, locationing and control/monitoring applications for wearable, home automation, industrial automation, lighting and home appliance markets.


Solution Highlights


  • Highly integrated and secure solution with dual-mode Bluetooth 5 and 802.15.4 (capable of running ZigBee or Thread)
  • Efficient on-chip application processor based on ARM® Cortex®-M4F with up to 180 MHz performance, up to 4 MB dedicated flash and up to 208 kB of RAM
  • Support for BLE 5 long range (125 kbps), high data rate (2 Mbps) and advertising extensions
  • Ultra-low power consumption with multiple power modes to reduce the system energy consumption
  • Multiple levels of security including PUF (Physically Unclonable Function), Crypto HW accelerators, Secure Bootloader and Secure Zone, to create a highly secure system
  • Ultra-small size SoC (3.51 mm x 3.6 mm) and module (4.63 mm x 7.90 mm) options (additional package options are also available)
  • Integrated wireless stacks and profiles for easy evaluation and integration
  • Leading edge RF performance (up to 20 dBm output power for BLE and 802.15.4) providing long range up and higher throughputs
  • Unique peripherals like ULP sub-system, Voice Activity Detection (VAD) and up to 8 capacitive touch sensor inputs


Microcontroller


  • ARM® Cortex®-M4 core with up to 180 MHz
  • Integrated FPU, MPU and NVIC
  • SWD and JTAG debug options
  • Internal and external oscillators with PLLs
  • Flash In-Application Programming (IAP), In-System Programming (ISP) and Over-the-Air Wireless Firmware Upgrade
  • Power-On Reset (POR), Brown-Out and Black-out Detect (BOD) with separate thresholds


Memory


  • Up to 4 MB integrated Quad-SPI flash with inline AES engine and XIP
  • Up to 208 KB SRAM
  • 4-way set-associative 16 KB I-Cache


Security


  • HW device identity and key storage with PUF
  • Trusted Execution Environment with Secure Boot loader
  • Accelerators: AES128/256, SHA256/384/512, RSA, ECC, ECDH, RNG, CRC


Bluetooth


  • Compliant to dual-mode Bluetooth 5
  • Transmit power up to +20 dBm1 for Bluetooth LE with integrated PA
  • Transmit power up to +15 dBm1 for Bluetooth EDR with integrated PA
  • Receive sensitivity as low as -104 dBm1
  • Data rates: 125 kbps, 500 kbps, 1 Mbps, 2Mbps, 3 Mbps
  • EDR+2.1, 4.0, 4.1, 4.2 and 5.0
  • BT LE 1 Mbps, 2 Mbps and Long Range modes
  • Piconet and scatternet
  • BT profile support2 for SPP, A2DP, AVRCP, HFP, PBAP, IAP, GAP, SDP, L2CAP, RFCOMM, GATT, IAP1, IAP2
  • BLE profile support2: GATT, PXP, HTP, HRP, BPM, VSPP, IPSP/IPSS, BLP, CGMP/CGMS, HOGP HID


802.15.42


  • Compliant to IEEE 802.15.4, 2.4 GHz
  • Transmit power up to +20 dBm1 with integrated PA
  • Receiver sensitivity of -102 dBm1
  • ZigBee PRO and Thread stack embedded
  • Supported modes2: ZigBee Coordinator, Router1, End device
  • Supported profiles2: Zigbee Light Link (ZLL), Home Automation (HA) and Smart Energy (SEP)
  • Supported Thread modes2: Border Router, Router, End Device


RF Features


  • Integrated baseband processor with calibration memory, RF transceiver, high-power amplifier, balun, T/R switch and flash memory (module)


MCU Sub-system Power Consumption


  • Active current as low as 19uA/MHz1 in low power mode
  • Deep sleep mode current: ~500nA1
  • Dynamic Voltage & Frequency Scaling
  • Deep sleep mode with only timer active - with and without RAM retention


Wireless Sub-system Power Consumption


  • 7.7 mA1 transmit current in BT 5 mode, 0 dBm output power, 1 Mbps data rate
  • 15 uA1 in BT 5 Connected mode (1s connection interval, 0dBm, 0byte)
  • 10.2 mA1 receive current in BT 5 mode, 1Mbps data rate


Digital Peripherals


  • USB HS OTG with integrated HS transceiver
  • 10/100 Mbps Ethernet MAC with RMII
  • SDIO 3.0 host and slave, SD/eMMC
  • 3x USART, 4x SPI, 3x I2C, 2x I2S, SIO, CAN 2.0B
  • Timers: 5x 32-bit, 1x 16/32-bit, 1x 24-bit, WWDT, RTC, RIT, QEI
  • Up to 85 GPIOs with GPIO multiplexer


Analog Peripherals


  • 12-bit 16-ch, 5 Msps ADC, 10-bit DAC
  • 3x op-amps, 2x Comparators and Temperature Sensor
  • 8 capacitive touch sensor inputs
  • Voice Activity Detection (VAD)


Software and Regulatory Certification


  • ZigBee Certification2, Bluetooth Qualification2
  • Regulatory certifications (FCC, IC, CE, ETSI, TELEC)2


Operating Conditions


  • Single supply: 2.1 to 3.6V or 1.85V
  • Operating temperature: -40°C to +85°C (Industrial grade)


Packages


  • LGA module
  • SoC packages - WLCSP, QFN and BGA


Evaluation Kit


  • RS13100-EVK1


Parameter

Frequency min
400 MHz
Frequency max
2400 MHz
Datarate
40000 kbps
Oper.temp.min.
-40 °C
Memory
FLASH
Memory size
4000 kB
MCU Architectur
32 bit
Supply Volt.min
2.1 V
P(out)
20 dBm
Sensitivity
104 dBm
RAM
400 kB
GPIO
85 no.
ADC resol.max
12 bit
ADC channels
16 no.
SPI
YES
USB
NO
I²C
YES
Other interface
UART,I2S
IEEE802.15.4
YES
IEEE802.15.1
YES
Wireless
TRANSCEIVE
Oper.temp.max
85 °C
Supply volt.max
3.6 V
Automotive
NO
Package
MODULE
Leadfree Defin.
10
Packaging
TRAY
Customs Tariff No.
85176200000
Country
China
Supplier Lead time
20 weeks
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